New Arrivals/Restock

Wiring Connecting Terminals - Manual Vacuum Suction Pen SMD IC Anti-Static Suction Cup Chip Extractor Suction Pen Welding Tool

flash sale iconLimited Time Sale
Until the end
10
11
36

€19.41 cheaper than the new price!!

Free shipping for purchases over €99
Please note that the sales price and tax displayed may differ between online and in-store. Also, the product may be out of stock in-store.
New  €32.35
quantity

Product details

Management number 208111429 Release Date 2026/03/22 List Price €12.94 Model Number 208111429
Category

The product has been updated with the same functionality.product Descriptions:There are three discs in the suction pen, which are large, medium and small models. The specifications are diameters: 3mm (2), 6mm, and 10mm. The adsorption capacity is 3g, 3g, 18g, 40g, respectively. Feet, double-sided pin IC, dedicated for IC extraction, anti-static, no power supply and battery can be used, especially convenient to take electronic parts and small products, simple operation, using a vacuum pen to pick up components and tweezers to pick up components Than, you can avoid touching the surrounding components.Instructions:1: First select the suction cup corresponding to the size of the IC to be sucked and put it on the suction pen nozzle.2: After the suction pen is installed with the suction cup, gently align the suction cup with the middle of the IC component (before making BGA, the surface of the component must be cleaned, otherwise it will affect the suction of the suction pen)3: Press the button on the suction pen to discharge the air from the device in the pen, and then release the button and the barrel will generate vacuum suction to suck up the IC.4: Place the sucked IC on the position to be placed, press the button, and the vacuum device in the pen barrel will exhaust air to make the IC fall off from the suction cup.

  • Instructions:
  • 1: First select the suction cup corresponding to the size of the IC to be sucked and put it on the suction pen nozzle.
  • 2: After the suction pen is installed with the suction cup, gently align the suction cup with the middle of the IC component (before making BGA, the surface of the component must be cleaned, otherwise it will affect the suction of the suction pen)
  • 3: Press the button on the suction pen to discharge the air from the device in the pen, and then release the button and the barrel will generate vacuum suction to suck up the IC.
  • 4: Place the sucked IC on the position to be placed, press the button, and the vacuum device in the pen barrel will exhaust air to make the IC fall off from the suction cup.
Manufacturer CHIKIMIKI

Correction of product information

If you notice any omissions or errors in the product information on this page, please use the correction request form below.

Correction Request Form

Product Review

You must be logged in to post a review